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mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 1 of 47 mpu - 3000 / mpu - 30 5 0 motion processing unit product specification rev 2 . 9
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 2 of 47 contents 1 document information ................................ ................................ ................................ ..................... 4 1.1 r evision h istory ................................ ................................ ................................ ................................ . 4 1.2 p urpose and s cope ................................ ................................ ................................ ............................ 6 1.3 p roduct o verview ................................ ................................ ................................ .............................. 6 1.4 s oftware s olutions ................................ ................................ ................................ .......................... 7 1.5 a pplic ations ................................ ................................ ................................ ................................ ........ 9 2 features ................................ ................................ ................................ ................................ ............... 10 2.1 s ensors ................................ ................................ ................................ ................................ ............. 10 2.2 d igital o utput ................................ ................................ ................................ ................................ .. 10 2.3 m otion p rocessing ................................ ................................ ................................ ........................... 10 2.4 c locking ................................ ................................ ................................ ................................ ............ 10 2.5 p ower ................................ ................................ ................................ ................................ ................ 10 2.6 p ackage ................................ ................................ ................................ ................................ ............. 11 3 electri c al character istics ................................ ................................ ................................ ........ 12 3.1 s ensor s pecifications ................................ ................................ ................................ ..................... 12 3.2 e lectrical s pecifications ................................ ................................ ................................ ................ 13 3. 3 e lectrical s pecifications , continued ................................ ................................ ............................ 14 3.4 e lectrical s pecifications , continued ................................ ................................ ............................ 15 3.5 i 2 c t iming c haracterization ................................ ................................ ................................ ............ 16 3.6 spi t iming c haracterization (mpu - 3000 only ) ................................ ................................ .............. 17 3.7 a bsolute m aximum r atings ................................ ................................ ................................ .............. 18 4 applications informa tion ................................ ................................ ................................ ............. 19 4.1 p in o ut and s ignal d escription ................................ ................................ ................................ ....... 19 4.2 t ypical o perating c ircuits ................................ ................................ ................................ ............. 20 4.3 b ill of m aterials for e xternal c omponents ................................ ................................ ................. 20 4.4 r ecommended p ower - on p rocedure ................................ ................................ .............................. 21 5 functional overview ................................ ................................ ................................ ....................... 22 5.1 b lock d iagram ................................ ................................ ................................ ................................ .. 22 5.2 o verview ................................ ................................ ................................ ................................ ........... 22 5.3 t hree - a xis mems g yroscope with 16 - bit adc s and s ignal c onditioning ................................ .. 22 5.4 d igital m otion p rocessor ................................ ................................ ................................ ............... 23 5.5 p rimary i 2 c and spi s erial c ommunications i nterfaces ................................ ............................... 23 5.6 s econdary i 2 c s erial i nterface ( for a third - party a ccelerometer or othe r sensors ) ........... 24 5.7 i nternal c lock g eneration ................................ ................................ ................................ ............. 26 5.8 c lock o utput ................................ ................................ ................................ ................................ .... 27 5.9 s ensor d ata r egisters ................................ ................................ ................................ ................... 27 5.10 fifo ................................ ................................ ................................ ................................ ................... 27 5.11 i nterrupts ................................ ................................ ................................ ................................ ......... 27 5.12 d igital - o ut put t emperature s ensor ................................ ................................ ............................. 27 5.13 b ias and ldo ................................ ................................ ................................ ................................ ..... 27 5.14 c harge p ump ................................ ................................ ................................ ................................ ..... 27 5.15 c hip v ersio n ................................ ................................ ................................ ................................ ...... 27 6 digital interface ................................ ................................ ................................ ............................... 28 6.1 i 2 c and spi (mpu - 3000 only ) s erial i nterfaces ................................ ................................ ............. 28 7 serial interface con siderations (mpu - 3050) ................................ ................................ ......... 33 7.1 mpu - 3050 s upported i nterfaces ................................ ................................ ................................ ... 33
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 3 of 47 7.2 l ogic l evels ................................ ................................ ................................ ................................ ...... 33 8 assembly ................................ ................................ ................................ ................................ ............... 36 8.1 o rientation of a xes ................................ ................................ ................................ ......................... 36 8.2 p ackage d imensions : ................................ ................................ ................................ ........................ 37 8.3 pcb d esign g uidelines : ................................ ................................ ................................ .................... 38 8.4 a ssembly p recautions ................................ ................................ ................................ ..................... 39 8.5 p ackage m arking s pecification ................................ ................................ ................................ ...... 42 8.6 t ape & r eel s pecification ................................ ................................ ................................ ................ 43 8.7 l abel ................................ ................................ ................................ ................................ .................. 44 8.8 p ackaging ................................ ................................ ................................ ................................ .......... 45 9 reliability ................................ ................................ ................................ ................................ ............ 46 9.1 q ualification t est p olicy ................................ ................................ ................................ ................ 46 9.2 q ualification t est p lan ................................ ................................ ................................ ................... 46 10 environmental compli ance ................................ ................................ ................................ ...... 47
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 4 of 47 1 document information 1.1 revision history revision date re vision description 0 6 / 2 5 /09 1.0 initial release 0 9/ 2 8 /09 2.0 changes for revision level compliance of mpu - 30x0 to mpu - 3000 s pecification : sec. 1.2 added revision b1 silicon note sec. 1.3 updated noise specification to 0.03o/s/hz 2 c interface sec. 3.1 updated sensor specifications table sec. 3.2 changed vdd to 2.5v and t a = 25 0 c sec. 3.2 - 3.3 changed electrical specifications table format and typical values sec. 4.1 updated pin - out and signal descriptions with new diagram sec. 4.2 updated typical operating circuit diagram sec. 5.1 updated new block diagram descriptions for primary and secondary i 2 c ser ial interfaces sec. 5.9 changed fifo description sec. 6 edited digital interface sec. 10.2 updated package drawing/dimensions sec. 10.7 edited trace routing sec. 13 added appendix 1.0 , errata for revision g devices 11/5/09 2.1 sec. 10 added material handling specification content 12/23/09 2.2 sec. 3.2 updated electrical specifications with power - s upply r amp r ate for vlogic reference voltage sec. 3.3 updated level output current specifications for the primary and secondary i 2 c interfaces sec . 3.4 updated frequency variation over temperature s pecification for i nternal c lock s ource sec. 3.5.1 updated esd s pecification sec. 4.4 added recommended p ower - o n p rocedure diagram 0 3/15/2010 2.3 sec . 1.4 added new invensense trademark s under applications sec . 2.2 edited digital output for 400khz standard (not up to) sec . 3.1 changed sensitivity scale factor to 115 lsb/(o/s) sec . 4.4 updated recommended power - on procedure diagram sec . 8.2 modified example power configuration diagram to remove ime - 3000 reference sec . 11.2 updated esd - hbm for device component level tests. removed all references to ime - 3000 and replaced with third - party accelerometer. 0 8/17 /2010 2.4 sec . 3.1 u pdated sensitivity scale factor, zro, noise performance sec . 3.2 a dded operating current for case without dmp a dded s tart - up t ime sec . 8.2 updated table with reference to aux_vddio sec . 9.1 added demo software section sec . 10 - 11 added register maps and register description sections sec . 12.9 updated table and accompanying t ext sec . 12.11 added storage specifications section sec . 14 added environment compliance section 0 8/26/2010 2.4b sec . 3.2 - 3.3 updated specifications for c i sec. 3.5 updated specifications for c b sec. 3.3 updated v ih and v hys
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 5 of 47 revision date re vision description 12/ 2 3/2010 2.5 sec. 9 removed mpl section. c reated a separate document for register i nformation 0 3 / 0 3 /2011 2.6 sec. 2.2 clarified spi usage case sec. 4.3 fixed c1 and c2 specifications sec. 5.5 clarified spi usage case sec. 5.5 documented inoperable primary bus when vdd is low and interface pins are low impedance sec. 5 .6 d ocumen ted gyro access capability in pass - through m ode sec. 5.6 d ocumented the secondary i 2 c bus i nternal pull up configuration sec. 7.2 modified d iagrams to clari fy usage of 3 rd party accelerometers sec. 8 modified a ssembly rules and moisture sensitivity level (msl) labels 05/19/2011 2.7 sec. 1.2 updated software references sec. 1.4 added section describing invensense software solutions sec. 3.2 clarified digital input and digital output specifications sec. 3.2 added clkout digital out specifications sec. 4.4 clarified t vlg - vdd value sec. 5.6 modified diagrams for clarity sec. 8.4.3 clarified trace routing precautions sec. 8.5 modified package marking diagrams for clarity sec. 8.8 updated packaging images 0 6/13 /2011 2.8 sec. 3.5 specified i 2 c timing specifications as only for the primary i 2 c bus. added reference to app note for details regarding the auxiliary i 2 c bus specification s . sec. 4.1 specified clkin and fsync to be connected to gnd if unused. sec. 4.4 m odified t vddr value for consistency with electrical characteristics . modified power up sequencing notes for clarity 11/14/2011 2.9 sec. 3.7 updated absolute maximum rating for acceleration sec. 8.5 updated package marking description
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 6 of 47 1.2 purpose and scope this document is a product specification, providing a description, specifications, and design related information for the mpu - 3000 ? and mpu - 3050 ? motion processing unit ? ( collectively called the mpu - 3 0 x0 ? ) . electrical characteristics are based upon simulation results and limited characterization data of advanced samples only. specifications are subject to change without notice. final specifications will be updated based upon characterization of final silicon. 1.3 product overview the mpu - 30x0 motion processing unit (mpu ? ) is the worlds first motionprocessing ? solution with integrated 6 - axis sensor fusion using its field - proven and proprietary motionfusion? engine for smart phone applications. the mpu - 30x0 has an embedded 3 - axis gyroscope and digital motion processor? (dmp) hardware accelerator engine with a secondary i 2 c port that interfaces to third party digital accelerometers to deliver a complete 6 - axis sensor fusion output to its primary i 2 c port. this combines both linear and rotational motion into a single data strea m for the application. this breakthrough in gyroscope technology provides a dramatic 68% smaller footprint, 40% thinner package, consumes 55% less power, and has inherent cost advantages compared to the latest competitive gyro solutions to uniquely address the fast - growing demand for 6 - axis motionprocessing in mobile handsets . the p rimary interface also supports spi protocol on the mpu - 3000 and can be used to r ead/ write to all the registers on the part. the mpus memory and fifo are not accessible via the spi interface. the mpu - 30x0 significantly extends and transforms motion sensing features provided by accelerometers beyond portrait and landscape orientation, to motionprocessing functionality. the mpu measures and processes both linear and rotational m o vements, creating a higher degree of 1:1 motion interactivity between the user and their handset. similar to the proliferation of bluetooth, camera phone image sensors and wi - fi, motionprocessing is becoming a must - have function in mobile handsets bene fitting wireless carriers, mobile handset oems, application developers and end - users. by providing an integrated sensor fusion output, the dmp in the mpu - 30x0 offloads the intensive motionprocessing computation requirements from the applications processor, reducing the need for frequent polling of the motion sensor output and enabling use of low cost, low power application processors thereby increasing overall battery life of handsets. s ince handsets today are of multi - function nature, mpu - 30x0 no t only provides accurate 1:1 motion tracking for some of the more common applications such as still/video image stabilization , gaming and dead reckoning , the 32 - bit dmp can be programmed to deliver advanced ui, e.g. multiple kinds of gestures and character recognition leading to applications such as airsign ?, touchanywhere ?, motioncommand ? . by leveraging its patented and volume - proven nasiri - fabrication platform, which integrates mems wafers with companion cmos electronics through wafer - level bonding, invensense has driven the mpu - 30x0 package size down to a revolutionary footprint of 4x4x0.9mm (qfn), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging to address a wide range of handheld consumer electronic devices.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 7 of 47 the mpu - 30x0 integrates 16 - bit analog - to - digital converters (adc s ), selectable low - pass filters, fifo, embedded temperature sensor, and fast mode i 2 c or spi (mpu - 3000 only) interfaces. performance features include programmable full - scale range from 250 degrees - per - sec ond up to 2000 degrees - per - second (o/s or dps ) , and low - noise of 0.0 1 o/s/hz , while providing the highest robustness supporting 10,000 g shock in operation. the highest cross - axis isolation is achieved by d esign from its single silicon integration. factory - calibrated initial sensitivity reduces production - line calibration requirements. the parts on - chip fifo and dedicated i 2 c - master accelerometer sensor bus simplify system timing and lower system power consumption . t he sensor bus allows the mpu - 30x 0 to directly acquire data from the off - chip accelerometer without interven tion from an external processor . other industry - leading features include a small 4mm x4mmx0.9mm plastic qfn package , an embedded temperature sensor, programmable interrupts, and a lo w 13mw power consumption. parts are available with i 2 c and spi serial interfaces, a vdd operating range of 2.1 to 3.6v, and a vlogic interface voltage from 1.71v to 3.6v. the mpu - 3000 and mpu - 3050 are identical, except that the mpu - 3050 supports the i 2 c s erial interface only, and has a separate vlogic reference pin (in addition to its analog supply pin, vdd), which sets the logic levels of its i 2 c interface. the vlogic voltage may be between 1.71v min to vdd max. the mpu - 3000 supports both i 2 c and spi interface s and has a single supply pin, vdd, which is the devices logic reference supply and the analog supply for the part. the table below outlines these differences: primary differences between mpu - 3000 and mpu - 3050 part / item mpu - 3000 mpu - 3050 vdd 2.1v to 3. 6 v 2.1v to 3. 6 v vlogic n/a 1.71v to vdd serial interfaces supported i 2 c, spi i 2 c pin 8 /cs vlogic pin 9 ad0/sdo ad0 pin 23 scl/sclk scl pin 24 sda/sdi sda 1.4 software solutions this section describes the motionapps? software solutions included with the invensense mpu ? ( motionprocessing unit ? ) and imu (inertial measurement unit) product families. please note that the products within the idg, ixz, and itg families do not include these software solutions. the motionapps platform is a complete software solution that in combination with the invensense imu and mpu motionprocessor ? families delivers robust, well - calibrated 6 - axis and/or 9 - axis sensor fusion data using its field proven and proprietary motionfusion? engine. sol ution packages are available for smartphones and tablets as well as for embedded microcontroller - based devices. the motionapps platform provides a turn - key solution for developers and accelerates time - to - market. it consists of complex 6/9 - axis sensor fusi on algorithms, robust multi - sensor calibration, a proven software architecture for android and other leading operating systems, and a flexible power management scheme. t he motionapps platform is integrated within the middleware of the target os ( the senso r framework ), and also provides a kernel device driver to interface with the physical device . this directly benefits application developers by providing a cohesive set of apis and a well - defined sensor data path in the user - space.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 8 of 47 the table below descri bes the motionapps software solutions included with the invensense mpu and imu product families. invensense motionprocessor devices and included motionapps software included software feature motionapps embedded motionapps motionapps lite embedded motionapps lite notes part number mpu - 3050 ? mpu - 6050 ? imu - 3000 ? processor type mobile application processor 8/16/32 - bit microcontroller mobile application processor 8/16/32 - bit microcontroller applications smartphones, tablets tv remotes, health/fitness, toys, other embedded smartphones, tablets tv remotes, health/fitness, toys, other embedded 6 - axis motionfusion yes yes < 2% application processor load using on - chip digital motion processor (dmp). reduces processing requirements for embedded applications 9 - axis motionfusion yes no gyro bias calibration yes yes no - m otion calibration and temperature calibration 3 rd party compass cal api yes no integrate s 3 rd party compass libraries gyro - assisted compass calibration (fast heading) yes no quick compass calibration using gyroscope magnetic anomaly rejection (improved heading) yes no use s gyro heading data when magnetic anomaly is detected the table below lists recommended documentation for the motionapps software solutions. software documentation platform motionapps and motionapps lite embedded motionapps and embedded motionapps lite software documentation ? installation guide for linux and android motionapps platform, v1.9 or later ? embedded motionapps platform user guide, v3.0 or later ? mpl functional specifications ? embedded mpl functional specifications for more information about the invensense motionapps platform, please visit the developers corner or consult your local invensense sales representative.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 9 of 47 1.5 applications ? blurfree ? technology ( for video/still image stabilization) ? airsign ? technology ( for security/authentication) ? touchanywhere ? technology ( for application control/navigation) ? motioncommand ? technology ( for g esture s hort - cuts) ? motion - enabled game and application framework ? instantgesture ? ig ? gesture recognition ? no touch ui ? handset gaming ? lo cation based s ervices, p oints of i nterest, and d ead r eckoning ? improved camera image quality through image stabilization ? health and sports monitoring ? power management
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 10 of 47 2 features the mpu - 30x0 motion processing unit includes a wide range of features: 2.1 sensors ? x - , y - , z - axis a ngular r ate s ensors ( gyro s) on one integrated circuit ? digital - o utput t emperature s ensor ? e xternal sync signal connected to the fsync pin support s image, video and gps synchronization ? 6 - axis motionprocessing capability using secondary i 2 c interface to directly connect to a digital 3 - axis third - party accelerometer ? factory calibrated scale factor ? high cross - axis isolation via proprietary mems design ? 10,000 g shock tolerant 2.2 digital output ? fast mode (400khz) i 2 c ? 1mhz spi (mpu - 3000 only) to access gyro , temp and auxiliary sensor registers only ; aimed at higher speed applications which need raw data, refer to s ection 5.5 for further explanation ? 16 - bit adcs for digitizing sensor outputs ? angular r ate s ensors ( gyros ) with applications - programmable full - s cale - r ange of 250/sec, 500/sec, 1000/sec, or 2000/sec. 2.3 motionprocessing ? embedded digital motion processing ? (dmp ? ) engine supports 3d motionprocessing and gesture recognition algorithms ? when used together with a digital 3 - axis third party accelerometer , the mpu - 30x0 collects the accelerometer data via a dedicated interface , while synchronizing data sampling at a user defined rate. the t otal data set obtained by the mpu - 30x0 includes 3 - axis gyroscope data and 3 - axis accelerometer data, temperature data, and the one bit external sync signal connected to the fsync pin. the mpu also downloads the results calculated by the digital 3 - axis thir d party accelerometer internal registers . ? fifo buffers complete data set, reduc ing timing requirements on the system processor and saving power by letting the processor burst read the fifo data, and then go into a low - power sleep mode while the mpu collect s more data. ? programmable interrupt supports features such as gestu re recognition, panning, zooming, scrolling, zero - motion detection , tap detect ion , and shake detection ? hand jitter filter ? programmable low - pass filter s ? feature extraction for pea k and zero - crossing detection ? pedometer functionality 2.4 clocking ? on - chip timing generator clock frequency 1 % over full temperature range ? optional external clock inputs of 32.768khz or 19.2mhz ? 1mhz clock output to synchronize with digital 3 - axis accelerometer 2.5 pow er ? vdd supply voltage range of 2.1v to 3.6v ? flexible vlogic reference voltage allows for multiple i 2 c interface voltage levels (mpu - 3050 only) ? p ower consumption with all three axe s and dmp active : 6.1 ma ? sleep mode: 5 a ? each axis can be individually powered down
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 11 of 47 2.6 package ? 4x4x0.9mm qfn plastic package ? mems structure hermetically sealed and bonded at wafer level ? rohs and green compliant
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 12 of 47 3 electri c al character istics 3.1 sensor specifications typical operating circuit of section 4.2 , vdd = 2.5v, vlogic = 2.5 v (mpu - 3050 only) , t a =25c. parameter conditions min typical max unit notes gyro sensitivity full - scale range fs_sel=0 250 o/s 4 , 7 fs_sel=1 500 4 , 7 fs_sel=2 1000 4 , 7 fs_sel=3 2000 4 , 7 gyro adc word length 16 b its 3 sensitivity scale factor fs_sel=0 fs_sel=1 fs_sel=2 fs_sel=3 1 31 65.5 32.8 16.4 lsb/(o/s) 1 3 3 3 sensitivity scale factor tolerance 25c - 6 2 +6 % 1 sensitivity scale factor variation over temperature - 40c to +85c 2 % 8 nonlinearity best fit straight line; 25c 0.2 % 6 cross - axis sensitivity 2 % 6 gyro zero - rate output (zro) initial zro tolerance 25c 20 o/s 1 zro variation over temperature - 40c to +85c 0.03 o/s /c 8 power - supply sensitivity (1 - 10hz) sine wave, 1 0 0mvpp; vdd=2. 2 v 0.2 o/s 5 power - supply sensitivity (10 - 250hz) sine wave, 1 0 0mvpp; vdd=2. 2 v 0.2 o/s 5 power - supply sensitivity (250hz - 100khz) sine wave, 1 0 0mvpp; vdd=2. 2 v 4 o/s 5 linear acceleration sensitivity static 0.1 o/s/ g 6 gyro noise performance fs_sel=0 total rms noise dlpfcfg=2 (100hz) 0. 1 o/s - r m s 1 low - frequency rms noise bandwidth 1hz to10hz 0.033 o/s - r m s 1 rate noise spectral density at 10hz 0.0 1 o/s/hz 3 gyro mechanical frequencies x - axis 30 33 36 khz 1 y - axis 27 30 33 khz 1 z - axis 24 27 30 khz 1 gyro start - up time dlpfcfg=0 zro settling to 1o/s of final 50 ms 5 temperature sensor range sensitivity untrimmed - 30 to 85 280 oc lsb/oc 2 2 room - temperature offset 35 o c - 13200 lsb 1 linearity best fit straight line ( - 30c to +85c) 1 c 2 temperature range specified temperature range - 40 85 oc 2 notes: 1. tested in production 2. based on characterization of 30 parts over temperature on evaluation board or in socket 3. based on design, through modeling , and simulation across pvt 4. typical. randomly selected part measured at room temperature on evaluation board or in socket 5. based on characterization of 5 parts over temperature 6. tested on 20 parts at room temperature 7. part is characterized to full - scale range. maximum adc output is [2 16 / (sensitivity x 2)] example: for sensitivity of 1 31 lsb/(o/s) , [2 16 / (1 3 1 x 2)] = 2 50 o/s . 8. based on characterization of 48 parts on evaluation board or in socket
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 1 3 of 47 3.2 electrical specification s typical operating circuit of section 4.2 , vdd = 2.5v, vlogic = 2.5v (mpu - 3050 only) , t a = 25 c. parameters conditions min typical max units notes vdd power supply operating voltage range 2.1 3.6 v 2 power - supply ramp rate monotonic ramp . ramp rate is 10% to 90% of the final value (see figure in section 4.4 ) 0 5 ms 2 normal operating current 6.1 ma 1 dmp disabled 5.9 ma 1 sleep mode current 5 a 4 vlogic reference voltage (must be regulated) voltage range vlogic must be vdd at all times 1.71 vdd v 3, 5 power - supply ramp rate monotonic ramp. ramp rate is 10% to 90% of the final value 1 ms 3, 5 normal operating current (see figure in section 4.4 ) does not include pull up resistor current draw as that is system dependent 100 a 4 start - up time for register read/write 20 100 ms 4 i 2 c address ad0 = 0 ad0 = 1 1101000 1101001 1 1 digital inputs (sdi /sda , sclk /scl , fsync, ad0, /cs, clkin) v ih , high level input voltage v il , low level input voltage c i , input capacitance mpu - 3000 mpu - 3050 mpu - 3000 mpu - 3050 0.7*v dd 0.7*vlogic < 5 0.3*v dd 0.3* vlogic v v v v pf 4 4 4 4 6 digital output ( sdo, int) v oh , high level output voltage v ol1 , low - level output voltage v ol.int1 , int low - level output v oltage output leakage current t int , int pulse width r load =1m? ; mpu - 3000 r load =1m? ; mpu - 3050 r load =1m? ; mpu - 3000 r load =1m? ; mpu - 3050 open=1, 0.3ma sink current open=1 latch_int_en=0 0.9*vdd 0.9*vlogic 100 50 0.1*vdd 0.1*vlogic 0.1 v v v v v na s 2 2 2 2 2 3 3 digital output (clkout) v oh , high level output voltage v ol1 , low - level output voltage rload=1m? rload=1m? 0.9*vdd 0.1*vdd v v 2 2 notes: 1. tested in production 2. based on characterization of 30 parts over temperature on evaluation board or in socket 3. typical. randomly selected part measured at room temperature on evaluation board or in socket 4. based on characterization of 5 parts over temperature 5. refer to section 4.4 for the recommended power - on procedure 6. guaranteed by design
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 14 of 47 3.3 electrical specifications, continued typical operating circuit of section 4.2 , vdd = 2.5v, vlogic = 2.5 v (mpu - 3050 only) , t a =25c. parameters conditions typical units notes primary i 2 c i/o (scl, sda) v il , low - level input voltage mpu - 3000 - 0.5 to 0.3* vdd v 1 v ih , high - level input voltage mpu - 3000 0.7* vdd to vdd + 0.5v v 1 v hys , hysteresis mpu - 3000 0.1* vdd v 1 v il , low level input voltage mpu - 3050 - 0.5v to 0.3*vlogic v 1 v ih , high - level input voltage mpu - 3050 0.7*vlogic to vlogic + 0.5v v 1 v hys , hysteresis mpu - 3050 0.1*vlogic v 1 v ol1 , low - level output voltage 3ma sink current 0 to 0.4 v 1 i ol , low - level output current v ol = 0.4v v ol = 0.6v 3 5 ma ma 1 1 output leakage current 100 na 2 t of , output fall time from v ihmax to v ilmax c b bus cap acitance in p f 20+0.1c b to 250 ns 1 c i , capacitance for each i/o pin < 10 pf 3 secondary i 2 c i/o ( aux _cl, aux _da) aux _vddio=0 (mpu - 3050) v il , low - level input voltage - 0.5 v to 0.3*vlogic v 1 v ih , high - level input voltage 0.7*vlogic to vlogic + 0.5v v 1 v hys , hysteresis 0.1*vlogic v 1 v ol1 , low - level output voltage vlogic > 2v; 1ma sink current 0 to 0.4 v 1 v ol3 , low - level output voltage vlogic < 2v; 1ma sink current 0 to 0.2*vlogic v 1 i ol , low - level output current v ol = 0.4v v ol = 0.6v 1 1 ma ma 1 1 output leakage current 100 na 2 t of , output fall time from v ihmax to v ilmax c b bus cap acitance in pf 20+0.1c b to 250 ns 1 c i , capacitance for each i/o pin < 10 pf 3 secondary i 2 c i/o ( aux _cl, aux _da) aux _vddio=1 v il , low - level input voltage - 0.5 to 0.3*vdd v 1 v ih , high - level input voltage 0.7*vdd to vdd+0.5v v 1 v hys , hysteresis 0.1*vdd v 1 v ol1 , low - level output voltage 1ma sink current 0 to 0.4 v 1 i ol , low - level output current v ol = 0.4v v ol = 0.6v 1 1 ma ma 1 1 output leakage current 100 na 2 t of , output fall time from v ihmax to v ilmax c b bus cap. in pf 20+0.1c b to 250 ns 1 c i , capacitance for each i/o pin < 10 pf 3 notes: 1. based on characterization of 5 parts over temperature. 2. typical. randomly selected part measured at room temperature on evaluation board or in socket 3. guaranteed by design
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 15 of 47 3.4 electrical specifications, continued typical operating circuit of section 4.2 , vdd = 2.5v, vlogic = 2.5v (mpu - 3050 only) , t a =25c. parameters conditions min typical max units notes internal clock source clk_sel =0,1,2,3 sample rate, fast dlpfcfg=0 sampleratediv = 0 8 khz 3 sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz 3 reference clock output clkouten = 1 1.024 mhz 3 clock frequency initial tolerance clk_sel =0, 25c - 5 + 5 % 1 clk_sel =1,2,3; 25c - 1 +1 % 1 frequency variation over temperature clk_sel =0 - 15 to +10 % 2 clk_sel =1,2,3 +/ - 1 % 2 pll settling time clk_sel =1,2,3 1 ms 4 external 32.768khz clock clk_sel =4 external clock frequency 32.768 khz 4 external clock jitter cycle - to - cycle r m s 1 to 2 s 4 sample rate, fast dlpfcfg=0 sampleratediv = 0 8.192 khz 4 sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1.024 khz 4 reference clock output clkouten = 1 1.0486 mhz 4 pll settling time 1 ms 4 external 19.2mhz clock clk_sel =5 external clock frequency 19.2 mhz 4 sample rate, fast dlpfcfg=0 sampleratediv = 0 8 khz 4 sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz 4 reference clock output clkouten = 1 1.024 mhz 4 pll settling time 1 ms 4 notes: 1. tested in production 2. based on characterization of 30 parts over temperature on evaluation board or in socket 3. typical. randomly selected part measured at room temperature on evaluation board or in socket 4. based on design, through modeling, and simulation across pvt
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 16 of 47 3.5 i 2 c timing characterization typical operating circuit of section 4.2 , vdd = 2.5v, vlogic = 1.8v5% (mpu - 3050 only) , 2.5v5%, 3.0v5%, or 3.3v5%, t a =25c. parameters conditions min typical max units notes i 2 c timing i 2 c fast - mode f scl , scl clock frequency 0 400 khz 1 t hd.sta , (repeated) start condition hold time 0.6 s 1 t low , scl low period 1.3 s 1 t high , scl high period 0.6 s 1 t su.sta , repeated start condition setup time 0.6 s 1 t hd.dat , sda data hold time 0 s 1 t su.dat , sda data setup time 100 ns 1 t r , sda and scl rise time c b bus cap. from 10 to 400pf 20+0.1 c b 300 ns 1 t f , sda and scl fall time c b bus cap. from 10 to 400pf 20+0.1 c b 300 ns 1 t su.sto , stop condition setup time 0.6 s 1 t buf , bus free time between stop and start condition 1.3 s 1 c b , capacitive load for each bus line < 400 pf 3 t vd.dat , data valid time 0.9 s 1 t vd.ack , data valid acknowledge time 0.9 s 1 notes: 1. based on characterization of 5 parts over temperature on evaluation board or in socket 2. s = start condition, p = stop condition, s r = repeated start condition 3. guaranteed by design note: specifications apply to the primary i 2 c bus only. for auxiliary i 2 c bus specifications, please refer to the application note, an - mpu - 3000a - 20. i 2 c bus timing diagram
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 17 of 47 3.6 spi timing characterization (mpu - 3000 only) typical operating circuit of section 4.2 , vdd = 2.1v to 3.6v, t a = - 40c to +85c, unless otherwise noted. typical values are at t a =25c. parameters conditions min typical max units spi timing f sclk , sclk clock frequency 0.9 1 mhz t low , sclk low period 400 ns t high , sclk high period 400 n s t su.cs , cs setup time 8 ns t hd.cs , cs hold time 500 ns t su.sdi , sdi setup time 11 ns t hd.sdi , sdi hold time 7 ns t vd.sdo , sdo valid time c load = 20pf 100 ns t hd.sdo , sdo hold time c load = 20pf 4 ns t dis.sdo , sdo output disable time 10 ns note: 1. based on characterization of 5 parts over temperature as mounted on evaluation board or in socket s spi bus timing diagram
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 18 of 47 3.7 absolute maximum ratings stress above those listed as absolute maximum ratings may cause permanent damage to the device. these are stress rating s only and functional operation of the device at these conditions is not implied. exposur e to the absolute maximum rating s conditions for extended periods may affect device reliability. absolute maximum ratings parameter rating supply voltage, vdd - 0.5v to +6v vlogic input voltage level (mpu - 3050) - 0.5v to vdd + 0.5v regout - 0.5v to 2v input voltage level (clkin, aux _da, ad0, fsync, int, scl, sda) - 0.5v to vdd + 0.5v cpout (2.1v vdd 3.6v ) - 0.5v to 30v acceleration (any axis, unpowered) 10,000 g for 0.2 ms operating temperature range - 40c to +105c storage temperature range - 40c to +125c electrostatic discharge (esd) protection 1.5 kv (hbm); 200v (mm) latch - up jedec class ii (2), 125c level b, 60ma
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 19 of 47 4 applications information 4.1 pin out and signal description pin number mpu - 3000 mpu - 3050 pin name pin description 1 y y clkin e xternal reference clock input . connect to gnd if unused. 6 y y aux _da interface to a 3 rd party accelerometer, sda pin. logic levels are set to be either vdd or vlogic. see s ection 6 for more details. 7 y y aux _cl interface to a 3 rd party accelerometer , scl pin. logic levels are set to be either vdd or vlogic. see s ection 6 for more details. 8 y /cs spi chip select (0=spi mode, 1= i 2 c mode) 8 y vlogic digital i/o supply voltage. vlogic must be vdd at all times. 9 y ad0 / sdo i 2 c slave address lsb (ad0); spi serial data output (sdo) 9 y ad0 i 2 c slave address lsb 10 y y regout regulator filter capacitor connection 11 y y fsync frame synchronization digital input . connect to gnd if unused. 12 y y int interrupt digital output (totem pole or open - drain) 13 y y vdd power supply voltage and digital i/o supply voltage 18 y y gnd power supply ground 19 y y resv reserved. do not connect. 20 y y cpout charge pump capacitor connection 21 y y resv reserved. do not connect. 22 y y clkout 1mhz clock output for third - party accelerometer synchronization 23 y scl / sclk i 2 c serial clock (scl); spi serial clock (sclk) 23 y scl i 2 c serial clock 24 y sda / sdi i 2 c serial data (sda); spi serial data input (sdi) 24 y sda i 2 c serial data 2, 3, 4, 5, 14, 15, 16, 17 y y nc not internally connected. may be used for pcb trace routing. 7 8 9 1 0 1 1 1 2 a u x _ c l v l o g i c a d 0 r e g o u t f s y n c i n t 1 3 1 8 1 7 1 6 1 5 1 4 n c n c n c v d d n c g n d 6 1 2 3 4 5 n c n c n c a u x _ d a n c c l k i n 2 4 2 3 2 2 2 1 2 0 1 9 r e s v c p o u t r e s v c l k o u t s c l s d a m p u - 3 0 5 0 q f n p a c k a g e ( t o p v i e w ) 2 4 - p i n , 4 m m x 4 m m x 0 . 9 m m o r i e n t a t i o n o f a x e s o f s e n s i t i v i t y a n d p o l a r i t y o f r o t a t i o n 7 8 9 1 0 1 1 1 2 a u x _ c l / c s a d 0 / s d o r e g o u t f s y n c i n t 1 3 1 8 1 7 1 6 1 5 1 4 n c n c n c v d d n c g n d 6 1 2 3 4 5 n c n c n c a u x _ d a n c c l k i n 2 4 2 3 2 2 2 1 2 0 1 9 r e s v c p o u t r e s v c l k o u t s c l / s c l k s d a / s d i m p u - 3 0 0 0 q f n p a c k a g e ( t o p v i e w ) 2 4 - p i n , 4 m m x 4 m m x 0 . 9 m m m p u - 3 0 0 0 m p u - 3 0 5 0 + z + x + y
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 20 of 47 4.2 typical operating circuit s 4.3 bill of materials for external components component label specification quantity regulator filter capacitor c 1 ceramic, x7r, 0.1f 10%, 2v 1 vdd bypass capacitor c 2 ceramic, x7r, 0.1f 10%, 4v 1 charge pump capacitor c3 ceramic, x7r, 2.2nf 10%, 50v 1 vlogic bypass capacitor c4* ceramic, x7r, 10nf 10%, 4v 1 * mpu - 3050 only a d 0 / s d o t y p i c a l o p e r a t i n g c i r c u i t s 7 8 9 1 0 1 1 1 2 1 3 1 8 1 7 1 6 1 5 1 4 6 1 2 3 4 5 2 4 2 3 2 2 2 1 2 0 1 9 m p u - 3 0 0 0 c l k i n / c s g n d g n d g n d f s y n c i n t g n d v d d s c l / s c l k s d a / s d i c 3 2 . 2 n f c 1 0 . 1 f c 2 0 . 1 f a d 0 7 8 9 1 0 1 1 1 2 1 3 1 8 1 7 1 6 1 5 1 4 6 1 2 3 4 5 2 4 2 3 2 2 2 1 2 0 1 9 m p u - 3 0 5 0 c l k i n g n d g n d g n d f s y n c i n t g n d v d d s c l s d a c 3 2 . 2 n f c 1 0 . 1 f c 2 0 . 1 f g n d v l o g i c c 4 1 0 n f a u x _ c l a u x _ d a a u x _ c l a u x _ d a c l k o u t c l k o u t
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 21 of 47 4.4 recommended power - on procedure t v l g r v l o g i c v d d t v d d r a l l v o l t a g e s a t 0 v p o w e r - u p s e q u e n c i n g 1 . v l o g i c a m p l i t u d e m u s t a l w a y s b e v d d a m p l i t u d e 2 . t v d d r i s v d d r i s e t i m e : t i m e f o r v d d t o r i s e f r o m 1 0 % t o 9 0 % o f i t s f i n a l v a l u e 3 . t v d d r i s 5 m s 4 . t v l g r i s v l o g i c r i s e t i m e : t i m e f o r v l o g i c t o r i s e f r o m 1 0 % t o 9 0 % o f i t s f i n a l v a l u e 5 . t v l g r i s 1 m s 6 . t v l g - v d d i s t h e d e l a y f r o m t h e s t a r t o f v d d r a m p t o t h e s t a r t o f v l o g i c r i s e 7 . t v l g - v d d i s 0 m s ; 8 . v d d a n d v l o g i c m u s t b e m o n o t o n i c r a m p s 9 0 % 1 0 % 9 0 % 1 0 % t v l g - v d d
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 22 of 47 5 functional overview 5.1 block diagram 5.2 overview the mpu - 30x0 is comprised of the following key blocks / functions : ? three - axis mems rate gyroscope sensor s with 16 - bit adcs and signal c onditioning ? digital motion processor ( dmp ) ? primary i 2 c and spi (mpu - 3000 only) serial communications interfaces ? s econdary i 2 c serial i nterface for 3 rd party accelerometer or other sensor s ? clock ing ? sensor data registers ? fifo ? interrupt s ? digital - output temperature sensor ? bias and ldo ? charge pump 5.3 three - axis mems gyroscope with 16 - bit adcs and signal conditioning the mpu - 30x0 consists of three independent vibratory mems rate gyroscopes, which detect rotation about the x, y, and z axes. when the gyros are rotated about any of the sense axes , the coriolis effect causes a vibration that is detected by a capacitive pickoff. the resulting signal is amplified, demodula ted, and filtered to produce a voltage that is proportional to the angular rate. this voltage is digitized using individual on - chip 16 - bit analog - to - digital converters (adcs) to sample each axis . the full - scale range of the gyro sensors may be digitally programmed to 250 , 500, 1000, or 2000 degre es per second (dps). adc sample rate is programmable from 8,000 samples per second , down to 3.9 samples per second , and user - selectable low - pass filters enable a wide range of cut - off frequencies . c l o c k m p u - 3 0 0 0 m p u - 3 0 5 0 c h a r g e p u m p ( / c s ) a d 0 / ( s d o ) s c l / ( s c l k ) s d a / ( s d i ) t e m p s e n s o r a d c a d c z g y r o s i g n a l c o n d i t i o n i n g a d c y g y r o s i g n a l c o n d i t i o n i n g a d c x g y r o s i g n a l c o n d i t i o n i n g d i g i t a l m o t i o n p r o c e s s o r ( d m p ) f s y n c 2 2 1 8 9 2 3 2 4 1 1 p r i m a r y i 2 c o r s p i s e r i a l i n t e r f a c e s e c o n d a r y i 2 c s e r i a l i n t e r f a c e c o n f i g r e g i s t e r c l o c k c p o u t s e c o n d a r y i n t e r f a c e b y p a s s m u x 7 6 a u x _ c l a u x _ d a i n t 1 2 s e n s o r r e g i s t e r 2 0 o t p f i f o i n t e r r u p t s t a t u s r e g i s t e r v d d b i a s & l d o g n d r e g o u t 1 3 1 8 1 0 [ v l o g i c ] 8 n o t e : p i n n a m e s i n r o u n d b r a c k e t s ( ) a r e m p u - 3 0 0 0 o n l y p i n n a m e s i n s q u a r e b r a c k e t s [ ] a r e m p u - 3 0 5 0 o n l y c l k i n c l k o u t
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 23 of 47 5.4 digital motion processor the embedded digital motion processor ( dmp ) is located within the mpu - 30x0 and offload s computation of motion processing algorithms from the host processor. the dmp acquires data from accelerometers, gyroscopes, and additional sensors such as magnetometers, and processes the data. th e resulting data can be read from the dmps registers, or can be buffered in a fifo. the dmp has access to some of mpus external pins, which can be used for synchronizing external devices to the motion sensors, or generating interrupts for the application . the purpose of the dmp is to offload both timing requirements and processing power from the host processor. typically, motion processing algorithms should be run at a high rate, often around 200hz, in order to provide accurate results with low latency. this is required even if the application updates at a much lower rate; for example, a low power user interface may update as slowly as 5hz, but the motion processing should still run at 200hz. the dmp can be used as a tool in order to minimize power, simpl ify timing and software architecture, and save valuable mips on the host processor for use in the application. 5.5 primary i 2 c and spi serial communications interface s the mpu - 30x0 has a primary i 2 c serial interface and the mpu - 3000 also supports spi protocol on the primary interface. spi interface can be used to read/write to all the registers of mpu - 3000 but the mpus memory and fifo are not accessible via the spi interface. mpu - 30x0 always act s as a slave when communicating to the system processor. the logic level for communications to the master is set by the voltage on the vlogic pin ( mpu - 3050) or by vdd (mpu - 3000) . the lsb of the of the i 2 c slave address is set by pin 9 (ad0). i 2 c and spi protocols are describe d in more detail in section 6 . note: when vdd is low, the primary i 2 c or spi (mpu - 3000 only) interface pins become low impedance and thus can load the serial bus. this is a concern if other devices are active on the bus during this time. spi usage case s (mpu - 3000 only ): accessing raw sensor data and configuring mpu - 3000 using spi interface primary interface on the mpu - 3000 supports spi protocol and this feature was designed in keeping in mind high speed applications which need access to raw sensor data. as depicted in the above diag ram all t he m p u - 3 0 0 0 a p p l i c a t i o n p r o c e s s o r p r i m a r y s p i i n t e r f a c e e x t e r n a l s e n s o r a u x i l i a r y i 2 c i n t e r f a c e g y r o r e g i s t e r s t e m p r e g i s t e r s e x t . s e n s o r r e g i s t e r s c o n f i g u r e r e g i s t e r s
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 24 of 47 sensor registers can be accessed using the spi interface and the mpu - 3000 can be configured through the spi interface. mpus memory and fifo are not accessible via the spi interface. dual mode operation using spi the mpu - 3000s spi interface can also be used in a dual - mode configuration as shown above. in this configuration, the application processor access es all the functions of mpu - 3000 using the i 2 c interface of the mpu - 3000, and the ois controller access es only raw data from the mpu - 3000 gyroscope registers using the spi interface. the multiplexer ( mux ) is used to select which interface device is connected to the primary serial interface of the mpu - 3000. the figure above is simplified, since there needs to be communication between the application processor and the ois controller, and this is not shown. 5.6 secondar y i 2 c serial interface ( for a third - party accelerometer or other sensors ) the mpu - 30x0 has a secondary i 2 c bus for communicating to an off - chip 3 - axis digital output accelerometer. this bus has two operating modes : i 2 c master mode , where the mpu - 30x0 acts as a master to an exter nal accelerometer connected to the secondary i 2 c bus ; and pass - through mode , where the mpu - 30x0 directly connects the primary and secondary i 2 c buses together, to allow the system processor to directly communicate with the external accelerometer. secondary i 2 c bus modes of operation: ? i 2 c m aster m ode : a llow s the mpu - 30x0 to directly access the data registers of an external digital accelerometer. in this mode, the mpu - 30x0 directly obtain s sensor data from accelerometers and optionally, another sensor (such as a magnetometer ) , thus allowing the on - chip dmp to generate sensor fusion data without intervention from the system applications processor. in i 2 c master mode , the mpu - 30x0 can be configured to perform burst read s , returning the following data from the accelerometer : ? x accel erometer data (2 bytes) ? y accel erometer data (2 bytes) ? z accel erome ter data (2 bytes) ? pass - t hrough mode : allow s an external system processor to act as master and directly communicate to the external accelerometer connected to the secondary i 2 c bus pins ( aux _da and aux _cl). this is useful for configuring the accelerometers, or for keeping the mpu - 30x0 in a low - power mode, when only accelerometers are to be used. in this mode, the secondary i 2 c bus control logic ( third - party accelerometer interface block ) of the mpu - 30x0 is d isabled, and the secondary i 2 c pins aux _da and aux _cl (pins 6 and 7) are connected to the main i 2 c bus (pins 23 and 24) through analog switches . in the p ass - t hrough m ode the system processor can still access mpu - 30x0 gyro data through the i 2 c interface. m p u - 3 0 0 0 a p p l i c a t i o n p r o c e s s o r o i s c o n t r o l l e r m u x i 2 c s p i p r i m a r y i 2 c / s p i i n t e r f a c e i 2 c o r s p i s e l e c t
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 25 of 47 secondary i 2 c bus io logic levels the logic levels of the secondary i 2 c bus can be programmed to be either vdd or vlogic (see s ection s 6 and 7 ). secondary i 2 c bus internal pull - up configuration ? i 2 c master mode equivalent circuit : the simplified equivalent circuit diagram below shows the mpu - 30 x 0 auxiliary i2c interface while in master mode. it should be noted that the aux_cl pin is output only and is driven by a cmos output buffer which does not require a pull - up resistor. the aux_da p in is open drain and an internal pull - up resistor is enabled. the cmos output buffer and the pull up resistor can be powered from vdd or vlogic. please refer to section 7.2 for more details. mpu - 30x0 i 2 c master mode a uxiliary i 2 c interface C equivalent circuit p n m p u - 3 0 x 0 v l o g i c / v d d a u x _ c l a u x _ d a p u l l u p e q u i v a l e n t ~ 2 . 5 k o h m
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 26 of 47 ? pass - through mode C equivalent circuit : the simplified equivalent circuit diagram below shows the mpu - 30x0 i2c interface during pass - through mode. internal analog switches are used to connect the primary and auxiliary i 2 c interfaces together (scl to aux_cl through a buffer and sda to aux_da pins through a level shifter ). mpu - 30x0 pass - through mode equivalent circuit 5.7 internal clock generation the mpu - 30x0 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for the internal synchronous circuitry. this synchronous circuitry include s the signal conditioning and adcs, the dmp , and various control circuits and registers. an on - chip pll provides flexibility in the allowable input s for generating this clock. allowable internal sources for generating the internal clock are: ? an internal relaxation oscillator ? any of the x, y, or z gyros (mems oscillators with a drift of 1 % over temperature) allowable external clocking sources are: ? 32.768khz square wave ? 19.2mhz square wave the choice of which source to select for generating the int ernal synchronous clock depends on the availability of external sources and the requirements for power consumption and clock accuracy . most likely , these requirements will vary by mode of operation. for example, in one mode, where the biggest concern is power consumption, one may wish to operate the digital motion processor of the mpu - 30x0 to process m p u - 3 0 x 0 v l o g i c / v d d a u x _ c l a u x _ d a l e v e l s h i f t e r c i r c u i t v l o g i c / v d d s c l s d a a n a l o g s w i t c h a n a l o g s w i t c h
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 27 of 47 accelerometer data, while keeping the gyros off . in this case, the internal relaxation oscillator is a good clock choice. however, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a more - accurate clock source. clock accuracy is important, since timin g errors directly affect the distance and angle calculations performed by the digital motion processor (or by extension, by any processor). there are also start - up conditions to consider. when the mpu - 30x0 initially starts up ; the device operates off of its internal clock until programmed to operate from another source. this allows the user, for example, to wait for the mems oscillators to stabilize before they a re selected as the clock source. 5.8 clock output in addition, the mpu - 30x0 provides a clock out put, which allows the device to operate synchronously with a n external digital 3 - axis accelerometer. operating synchronously provides for higher - quality sensor fusion data, since the sampling instant for the sensor data can be set to be coincident for all sensors . 5.9 sensor data registers the sensor data registers contain the latest gyro and temperature data. they are read - only registers, and are access ed via the serial interface. data from these registers may be read any time, however, the interrupt function may be used to determine when new data is available. 5.10 fifo the mpu - 30x0 contains a 512 - byte fifo register that is accessible via the serial interface. the fifo configuration register determine s what data goes into it , with possible choices being gyro data , accelerometer data , temperature readings , auxiliary adc readings , and fsync input . a fifo counter keeps track of how many bytes of valid data are contained in the fifo. t he fifo register supports burst reads. the interr upt function may be used to determine when new data is available. 5.11 interrupt s interrupt functionality is configured via the interrupt configuration register. items that are configurable include the int pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. items that can trigger an interrupt are (1) clock generator locked to new reference oscillator (used when switching clock sources); (2) digital motion processor done (programmable function); (3) new data is availab le to be read (from the fifo and data registers); and (4) the mpu - 3 0x 0 did not receive an acknowledge from the accelerometer on the secondary i 2 c bus. the interrupt status can be read from the interrupt status register. 5.12 digital - output temperature sensor an on - chip temperature sensor and adc are used to measure the mpu - 30x0 die temperature. the readings from the adc can be read from the fifo or the sensor data registers. 5.13 bias and ldo the bias and ldo section generates the internal supply and the reference voltages and currents required by the mpu - 30x0. its two inputs are an unregulated vdd of 2.1v to 3.6v and a vlogic logic reference supply voltage of 1.71v to vdd (mpu - 3050 only) . the ldo output is bypassed by a 0.1f capacitor at regout. 5.14 charge pump an on - board charge pump generates the high voltage required for the mems oscillators. its output is bypassed by a 2.2nf capacitor at cpout. 5.15 chip version the chip version is written into otp memory.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 28 of 47 6 digital interface 6.1 i 2 c and spi (mpu - 3000 only) serial interfaces the internal registers and memory of the mpu - 3000/mpu - 3050 can be accessed using either i 2 c or spi (mpu - 3000 & raw sensor data only ). spi operates in four - wire mode. serial interface pin number mpu - 3000 mpu - 3050 pin name pin description 8 y /cs spi chip select (0=spi mode, i 2 c disable, 1= i 2 c mode, spi disable) 8 y vlogic digital i/o supply voltage. vlogic must be vdd at all times. 9 y ad0 / sdo i 2 c slave address lsb (ad0); spi serial data output (sdo) 9 y ad0 i 2 c slave address lsb 23 y scl / sclk i 2 c serial clock (scl); spi serial clock (sclk) 23 y scl i 2 c serial clock 24 y sda / sdi i 2 c serial data (sda); spi serial data input (sdi) 24 y sda i 2 c serial data note 1: to prevent switching into i 2 c mode when using spi (mpu - 3000), the i 2 c interface should be disabled by setting the i2c_if_dis configuration bit in the who_am_i register. setting this bit should be performed immediately after waiting the time specified by the start - up time for register read/write in secti on 3.2 . 6.1.1 i 2 c interface i 2 c is a two - wire interface comprised of the signals serial data (sda) and serial clock (scl). in general, the lines are open - drain and bi - directional. in a generalized i 2 c interface implementation, attached devices can be a master or a slave. the master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. the mpu - 30 x0 always operates as a slave device when communicating to the system processor, which thus acts as the master. sda and scl lines typically need pull - up resistors to vdd. the maximum bus speed is 400khz. the slave address of the mpu - 30x0 is b110100x which is 7 bits long. the lsb bit of the 7 bit address is determined by the logic level on pin ado. this allows two mpu - 30x0s to be connected to the same i 2 c bus. when used in this configuration, the address of the one of the devices should be b1101000 (p in ado is logic low) and the address of the other should be b1101001 (pin ad0 is logic high). the i 2 c address is stored in who_am_i register. i 2 c communications protocol start (s) and stop (p) conditions communication on the i 2 c bus starts when the master puts the start condition (s) on the bus, which is defined as a high - to - low transition of the sda line while scl line is high (see figure below). the bus is considered to be busy until the master puts a stop condition (p) on the bus, which is defined as a low to high transition on the sda line while scl is high (see figure below). additionally, the bus remains busy if a repeated start (sr) is generated instead of a stop condition.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 29 of 47 start and stop conditions data format / ackn owledge i 2 c data bytes are defined to be 8 bits long. there is no restriction to the number of bytes transmitted per data transfer. each byte transferred must be followed by an acknowledge (ack) signal. the clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down sda and holding it low during the high portion of the acknowledge clock pulse. if a slave is busy and is unable to transmit or receive another byte of data until some other task has been performed, it can hold scl low, thus forcing the master into a wait state. normal data transfer resumes when the slave is ready, and releases the clock line (refer to the following figure). acknow ledge on the i 2 c bus communications after beginning communications with the start condition (s), the master sends a 7 - bit slave address followed by an 8 th bit, the read/write bit. the read/write bit indicates whether the master is receiving data from or i s writing to the slave device. then, the master releases the sda line and waits for the acknowledge signal (ack) from the slave device. each byte transferred must be followed by an acknowledge bit. to acknowledge, the slave device pulls the sda line low and keeps it low for the high period of the scl line. data transmission is always terminated by the master with a stop condition (p), thus freeing the communications line. however, the master can generate a repeated start condition (sr), and address anot her slave without first generating a stop condition (p). a low to high transition on the sda line while scl is high defines the stop condition. all sda changes should take place when scl is low, with the exception of start and stop conditions. s d a s c l s s t a r t c o n d i t i o n s t o p c o n d i t i o n p d a t a o u t p u t b y t r a n s m i t t e r ( s d a ) d a t a o u t p u t b y r e c e i v e r ( s d a ) s c l f r o m m a s t e r s t a r t c o n d i t i o n c l o c k p u l s e f o r a c k n o w l e d g e m e n t a c k n o w l e d g e n o t a c k n o w l e d g e 1 2 8 9
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 30 of 47 complete i 2 c data transfer to write the internal mpu - 30x0 registers, the master transmits the start condition (s), followed by the i 2 c address and the write bit (0). at the 9 th clock cycle (when the clock is high), the mpu - 30x0 acknowledges the transfer. then the master puts the register address (ra) on the bus. after the mpu - 30x0 acknowledges the reception of the register address, the master puts the register data onto the bus. this is followed by the ack signal, and data transfer may be concluded by the stop condition (p). to write multiple bytes after the last ack signal, the master can continue outputting data rather than transmitting a stop signal. in this case, the mpu - 30x 0 automatically increments the register address and loads the data to the appropriate register. the following figures show single and two - byte write sequences. single - byte write sequence burst write sequence to read the internal mpu - 30x0 registers, the master sends a start condition, followed by the i 2 c address and a write bit, and then the register address that is going to be read. upon receiving the ack signal from the mpu - 30x0, the master transmits a start signal followed by the slave address and read bit. as a result, the mpu - 30x0 sends an ack signal and the data. the communication ends with a not acknowledge (nack) signal a nd a stop bit from master. the nack condition is defined such that the sda line remains high at the 9 th clock cycle. the following figures show single and two - byte read sequences. single - byte read sequence burst read sequence master s ad+w ra data p slave ack ack ack master s ad+w ra data data p slave ack ack ack ack master s ad+w ra s ad+r nack p slave ack ack ack data master s ad+w ra s ad+r ack nack p slave ack ack ack data data s d a s t a r t c o n d i t i o n s c l a d d r e s s r / w a c k d a t a a c k d a t a a c k s t o p c o n d i t i o n s p 1 C 7 8 9 1 C 7 8 9 1 C 7 8 9
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 31 of 47 i 2 c terms signal description s start condition: sda goes from high to low while scl is high ad slave i 2 c address w write bit (0) r read bit (1) ack acknowledge: sda line is low while the scl line is high at the 9 th clock cycle nack not - acknowledge: sda line stays high at the 9 th clock cycle ra mpu - 30x0 internal register address data transmit or received data p stop condition: sda going from low to high while scl is high
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 32 of 47 6.1.2 spi interface (mpu - 3000 only) spi is a 4 - wire synchronous serial interface that uses two control and two data lines. the mpu - 3000 always operates as a slave device during standard master - slave spi operation. with respect to the master, the serial clock output (sclk), the data output (sdo) and the data input (sdi) are shared among the slave devices. the master generates an independent chip select (/cs) for each slave device; /cs goes low at the start of transmission and goes back high at the end. the serial data output (sdo) line, remains in a high - impedance (high - z) state when the device is not selected, so it does not interfere with any active devices. spi operational features 1. data is delivered msb first and lsb last 2. data is latched on rising edge of sclk 3. data should be transitioned on the falling edge of sclk 4. sclk frequency is 1mhz max 5. spi read and write operations are completed in 16 or more clock cycles (two or more bytes). the first byte contain s the spi address, and the following byte(s) contain(s) the spi data. the first bit of the first byte contains the read/write bit and indicates the read (1) or write (0) operation. the following 7 bits contain the register address. in cases of multiple - b yte read/writes, data is two or more bytes: spi address format msb lsb r/w a6 a5 a4 a3 a2 a1 a0 spi data format msb lsb d7 d6 d5 d4 d3 d2 d1 d0 6. supports single or burst read/writes. each spi slave requires its own chip select (/cs) line. sdo, sdi and sclk lines are shared. only one /cs line is active (low) at a time ensuring that only one slave is selected at a time. the /cs lines of other slaves are held high which causes their respective sdo pins to be high - z. t y p i c a l s p i m a s t e r / s l a v e c o n f i g u r a t i o n s p i m a s t e r s p i s l a v e 1 s p i s l a v e 2 / c s 1 / c s 2 s c l k s d i s d o / c s s c l k s d i s d o / c s
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 33 of 47 7 serial interface considerations (mpu - 3050) 7.1 mpu - 3050 supported interfaces the mpu - 3 0 5 0 supports i 2 c communications on both its primary (microprocessor) serial interface and its secondary (accelerometer) interface. 7.2 logic levels the mpu - 3050 i / o logic levels are set to be either vdd or vlogic, as shown in the table below. i/o logic levels vs. aux _vddio ( secondary i 2 c bus io level ) aux _vddio microprocessor logic levels (pins: sda, scl, ad0,clkin, int ) accelerometer logic levels (pins: aux _da, aux _cl) 0 vlogic vlogic 1 vlogic vdd notes: 1. clkout has logic levels that are always referenced to vdd 2. the power - on - reset value for aux _vddio is 0. vlogic may be set to be equal to vdd or to another voltage, such that at all times vlogic is vdd. when aux _vddio is set to 0 (its power - on - reset value), vlogic is the power supply voltage for both the microprocessor system bus and the accelerometer secondary bus, as shown in the figure of section 7.2.1 . when aux _vddio is set to 1, vlogic is the power supply voltage for the microprocessor system bus and vdd is the supply for the accelerometer secondary bus, as shown in the figure of section 7.2.2 .
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 34 of 47 7.2.1 aux _vddio = 0 the figure below shows logic levels and voltage connections for aux _vddio = 0. note: actual configuration will depend on the type of third - party accelerometer used. i/o levels and connections for aux _vddio = 0 m p u - 3 0 x 0 3 r d p a r t y a c c e l s d a a u x _ c l s c l a u x _ d a v d d _ i o v d d v d d s a 0 c s i n t 2 i n t 1 s y s t e m p r o c e s s o r c l k i n s y s t e m b u s v l o g i c v l o g i c v l o g i c v d d v d d v l o g i c ( 0 v - v l o g i c ) c l k o u t s c l s d a i n t f s y n c v l o g i c a d 0 ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) n o t e s : 1 . a u x _ v d d i o i s b i t 7 i n r e g i s t e r 2 4 , a n d d e t e r m i n e s t h e i o v o l t a g e l e v e l s o f a u x _ d a a n d a u x _ c l ( 0 = s e t o u t p u t l e v e l s r e l a t i v e t o v l o g i c ) 2 . c l k o u t i s a l w a y s r e f e r e n c e d t o v d d 3 . o t h e r m p u - 3 0 5 0 l o g i c i o a r e a l w a y s r e f e r e n c e d t o v l o g i c ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) 0 v - v d d ( 0 v , v l o g i c ) n o c o n n e c t ( 0 v , v l o g i c ) s c l s d a
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 35 of 47 7.2.2 aux _vddio = 1 when aux _vddio is set to 1 by the user, vlogic is the power supply voltage for the microprocessor system bus and vdd is the power supply for the accelerometer secondary bus, as shown in the figure below. this is useful when interfacing to a third - party accelerometer wh ere there is only one supply for both the logic and analog sections of the 3 rd party accelerometer. i / o levels and connections for two example power configurations ( aux _vddio = 1) note: actual configuration will depend on the type of third - party accelerometer used. m p u - 3 0 x 0 3 r d p a r t y a c c e l s d a a u x _ c l s c l a u x _ d a v d d v d d a d d r i n t 2 i n t 1 s y s t e m p r o c e s s o r c l k i n s y s t e m b u s v l o g i c v d d c o n f i g u r a t i o n 1 c o n f i g u r a t i o n 2 1 . 8 v 5 % 2 . 5 v 5 % 3 . 0 v 5 % 3 . 0 v 5 % v o l t a g e / c o n f i g u r a t i o n v l o g i c v l o g i c v d d v d d v l o g i c c l k o u t s c l s d a i n t f s y n c v l o g i c a d 0 ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) a u x _ v d d i o 1 1 n o t e s : 1 . a u x _ v d d i o i s b i t 7 i n r e g i s t e r 2 4 , a n d d e t e r m i n e s t h e i o v o l t a g e l e v e l s o f a u x _ d a a n d a u x _ c l ( 1 = s e t o u t p u t l e v e l s r e l a t i v e t o v d d ) 2 . c l k o u t i s a l w a y s r e f e r e n c e d t o v d d 3 . o t h e r m p u - 3 0 5 0 l o g i c i o a r e a l w a y s r e f e r e n c e d t o v l o g i c 4 . t h i r d - p a r t y a c c e l e r o m e t e r l o g i c l e v e l s a r e r e f e r e n c e d t o v d d ; s e t t i n g i n t 1 a n d i n t 2 t o o p e n - d r a i n c o n f i g u r a t i o n p r o v i d e s v o l t a g e c o m p a t i b i l i t y w h e n v d d v l o g i c . w h e n v d d = v l o g i c , i n t 1 a n d i n t 2 m a y b e s e t t o p u s h - p u l l o u t p u t s , a n d t h e e x t e r n a l p u l l - u p r e s i s t o r s w i l l n o t b e n e e d e d . ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) 0 v - v d d 0 v - v d d 0 v - v d d d i o ( 0 v , v l o g i c ) 0 v - v d d v l o g i c ( 0 v - v l o g i c ) ( 0 v - v l o g i c ) s c l s d a
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 36 of 47 8 assembly this section provides general guidelines for assembling invensense micro electro - mechanical systems (mems) gyros packaged in quad flat no leads package ( qfn) surface mount integrated circuits. 8.1 orie ntation of axes the diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. note the pin 1 identifier in the figure. o r i e n t a t i o n o f a x e s o f s e n s i t i v i t y a n d p o l a r i t y o f r o t a t i o n m p u - 3 0 0 0 m p u - 3 0 5 0 + z + x + y
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 37 of 47 8.2 package dimensions : symbols dimensions in millimeters min nom max a 0.85 0.90 0.95 a1 0.00 0.02 0.05 b 0.18 0.25 0.30 c --- 0.20 ref. --- d 3.90 4.00 4.10 d2 2.95 3.00 3.05 e 3.90 4.00 4.10 e2 2.75 2.80 2.85 e --- 0.50 --- f (e-b) 0.20 0.25 0.32 l 0.30 0.35 0.40 l1 0.35 0.40 0.45 i 0.20 0.25 0.30 r 0.05 --- 0.10 s 0.05 --- 0.15 s1 0.15 0.20 0.25 r s s a1 a e d pin 1 identifier is a laser marked fe a ture on t o p c e2 l1 (12x) d2 l(12x) b e f s1 i pin 1 identifier c 0.16 on 4 corner lead dim. 1 6 7 12 13 18 19 24 1 6 7 12 13 18 19 24 s1 i
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 38 of 47 8.3 pcb design guidelines : the pad diagram using a jedec type extension with solder rising on the outer edge is shown below . the pad dimensions table shows pad sizing (mean dimensions) recommended for the mpu - 30x0 product. jedec type extension with solder rising on outer edge p cb lay - out diagram symbols dimensions in millimeters nom nominal package i/o pad dimensions e pad pitch 0.50 b pad width 0.25 l pad length 0.35 l1 pad length 0.40 d package width 4.00 e package length 4.00 d2 exposed pad width 3.00 e2 exposed pad length 2.80 i/o land design dimensions (guidelines ) d3 i/o pad extent width 4.80 e3 i/o pad extent length 4.80 c land width 0.35 tout outward extension 0.40 tin inward extension 0.05 l2 land length 0.80 l3 land length 0.85 pcb dimensions table (for pcb lay - out diagram)
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 39 of 47 8.4 assembly precautions 8.4.1 gyroscope surface mount guidelines invensense mems gyros sense rate of rotation. in addition, gyroscopes sense mechanical stress coming from the printed circuit board ( pcb ) . this pcb stress can be min imized by adhering to certain design rules: when using mems gyroscope components in plastic packages, pcb mounting and assembly can cause package stress . this package stress in turn can affect the output offset and its valu e over a wide range of temperatures. this stress is caused by the mismatch between the coefficient of linear thermal expansion (c t e) of the package material and the pcb. care must be taken to avoid package stress due to mounting. traces connected to pads should be as symmetric as possible. maximizing s ymmetry and balance for pad connection will help component self alignment and will lead to better control of solder paste reduction after reflow. any material used in the surface mount assembly process of the mems gyroscope should be free of restricted rohs elements or compounds. pb - free solders should be used for assembly. 8.4.2 exposed die pad precautions the mpu - 30x0 has very low active and standby c urrent consumption. the exposed die pad is not required for heat sinking, and should not be soldered to the pcb . failure to adhere to this rule can induce performance changes due to package thermo - mechanical stress. there is no electrical connection between the pad and the cmos. 8.4.3 trace routing routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited. routed ac tive signals may harmonically couple with the gyro mems devices, compromising gyro response. these devices are designed with the drive f requencies as follows: x = 333khz, y = 303khz, and z=273kh z. to avoid harmonic coupling dont route active signals in non - shielded signal planes directly below, or above the gyro package. note: for best performance, design a ground plane under the e - pad to reduce pcb signal noise from the board on which the gyro device is mounted. if the gyro device is stacked under an a djacent pcb board, design a ground plane directly above the gyro device to shield active signals from the adjacent pcb board. 8.4.4 component placement do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes a t a distance of less than 6 mm from the mems gyro. maintain generally accepted industry design practices for component placement near the mpu - 30x0 to prevent noise coupling and thermo - mechanical stress. 8.4.5 pcb mounting and cross - axis sensitivity orientation e rrors of the gyroscope mounted to the printed circuit board can cause cross - axis sensitivity in which one gyro responds to rotation about another axis . f or example, the x - axis gyroscope may respond to rotation about the y or z axes. the orientation mountin g errors are illustrated in the figure below. .
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 40 of 47 the table below shows the cross - axis sensitivity of the gyroscop e for a given orientation error. cross - axis sensitivity vs. orientation error orientation error ( or ) in or in) 0o 0% 0.5o 0.87% 1o 1.75% the specification for cross - axis sensitivity in section 3.1 includes the effect of the die orientation error with respect to the package. 8.4.6 mems handling instructions mems (micro electro - mechanical systems) are a time - proven, robust technology used in h undreds of millions of consumer, automotive and industrial products. mems devices consist of microscopic moving mechanical structures. they differ from conventional ic products, even though they can be found in similar packages. therefore, mems devices req uire different handling precautions than conventional ics prior to mounting onto printed circuit boards (pcbs). the mpu - 30x0 gyroscope has been qualified to a shock tolerance of 10,000 g . invensense packages its gyroscopes as it deems proper for protection against normal handling and shipping. it recommends the following handling precautions to prevent potential damage. ? do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. components placed in trays could be subject to g - forces in excess of 10,000 g if dropped. ? printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart. this could also create g - forces in excess of 10,000 g. 8.4.7 esd considerations establish and use esd - safe handling precautions when unpacking and handling esd - sensitive devices. ? store esd sensitive devices in esd safe containers until ready for use. the tape - and - reel moisture - sealed bag is an esd approved barrier. the best practice is to keep the units in the original moisture sealed bags until ready for assembly. ? restrict all device handling to esd protected work areas that measure less than 200v static charge. ensure that all workstations and personnel are properly grounded to prev ent esd. p a c k a g e g y r o a x e s ( ) r e l a t i v e t o p c b a x e s ( ) w i t h o r i e n t a t i o n e r r o r s ( a n d ) m p u - 3 0 0 0 m p u - 3 0 5 0 x y z
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 41 of 47 8.4.8 reflow specification qualification reflow: the mpu - 30 x 0 gyroscope was qualified in accordance with ipc/jedec j - std - 020d.01. this standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and mechanical damage during the solder reflow attachment phase of assembly. the c lassification specifies a sequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed by three solder reflow cycles and functional testing for qualificatio n. all temperatures refer to the topside of the qfn package, as measured on the package body surface. the peak solder reflow classification temperature requirement is (260 +5/ - 0c) for lead - free soldering of components measuring less than 1.6 mm in thickne ss . production reflow: check the recommendations of your solder manufacturer. for optimum results, production solder reflow processes should reduce exposure to high temperatures, and use lower ramp - up and ramp - down rates than those used in the component qualification profile shown for reference below. production reflow should never exceed the maximum constraints listed in the table and shown in the figure below . these constraints were used for the qualification profile, and represent the maximum tolerab le ratings for the device. maximum temperature ir / convection solder reflow curve used for qualification temperature set points for ir / convection reflow corresponding to figure above step setting constraints temp (c) time (sec) rate (c/sec) a t room 25 b t smin 150 c t smax 200 60 < t bc < 120 d t liquidus 217 r (tliquidus - tpmax) < 3 e t pmin [255c, 260c] 255 r (tliquidus - tpmax) < 3 f t pmax [ 260c, 265c] 260 t af < 480 r (tliquidus - tpmax) < 3 g t pmin [255c, 260c] 255 10< t eg < 30 r (tpmax - tliquidus) < 4 h t liquidus 217 60 < t dh < 120 i t room 25 note: for users t pmax must not exceed the classification temperature (260c). for suppliers t pmax must equal or exceed the classification temperature.
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 42 of 47 8.4.9 st o rage specifications the storage specification of the mpu - 30 x 0 gyroscope conforms to ipc/jedec j - std - 020 d.01 moisture sensitivity level (msl) 3. calculated shelf - life in moisture - sealed bag 12 months -- storage conditions: <40c and <90% rh after opening moisture - sealed bag 168 ho urs -- stora ge conditions: ambient 30c at 60% 8.5 package marking specification package marking specification i n v e n s e n s e m p u - 3 0 0 0 x x x x x x - x x x x y y w w x l o t t r a c e a b i l i t y c o d e f o u n d r y c o d e p a c k a g e v e n d o r c o d e r e v c o d e y y = y e a r c o d e w w = w o r k w e e k t o p v i e w i n v e n s e n s e m p u - 3 0 5 0 x x x x x x - x x x x y y w w x
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 43 of 47 8.6 tape & reel specification tape dimensions reel outline drawing reel dimensions and package size p ac k a g e size reel (mm) l v w z 4x4 330 100 13.2 2.2
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 44 of 47 tape and reel specification reel specifications quantity per reel 5,000 reels per box 1 boxes per carton (max) 3 pieces per carton (max) 15,000 8.7 l abel location of label package orientation pin 1 user direction of feed cover tape (anti - static) carrier tape (anti - static) label reel terminal tape
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 4 5 of 47 8.8 packaging moisture barrier bag with labels esd anti - static label moisture - sensitiv ity caution label tape & reel barcode label reel in box box with tape & reel label moisture - sensitive caution label
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 46 of 47 9 reliability 9.1 qualification test policy before invensense product s are released for production, they complete a series of q ualification t est s . the qualification test plan for the mpu - 30x0 followed the jedec jesd47g.01 standard, stress - test - driven qualification of integrated circuits . t he individual tests are described below. 9.2 qualification test plan accelerated life tests test method/condition lot quantity sample / lot acc / reject criteria high temperature operating life (htol/lfr) jedec jesd22 - a108c, dynamic, 3.63v biased, tj>125c [read - points 168, 500, 1000 hours] 3 77 (0/1) highly accelerated stress test (1) (hast) jedec jesd22 - a118 condition a, 130c, 85%rh, 33.3 psia., unbiased, [read - point 96 hours] 3 77 (0/1) high temperature storage life (hts) jedec jesd22 - a103c, cond. a, 125c, non - biased bake [read - points 168, 500, 1000 hours] 3 77 (0/1) device component level tests test method/condition lot quantity sample / lot acc / reject criteria esd - hbm jedec jesd22 - a114f, (1.5kv) 1 3 (0/1) esd - mm jedec jesd22 - a115 - a, (200v) 1 3 (0/1) latch up jedec jesd78b class ii (2), 125c; level b 60ma 1 6 (0/1) mechanical shock jedec jesd22 - b104c, mil - std - 883h, method 2002.5, cond. e, 10,000 gs , 0.2ms, x, y, z C 6 directions, 5 times/direction 3 30 (0/1) vibration jedec jesd22 - b103b, variable frequency (random), cond. b, 5 - 500hz, x, y, z C 4 times/direction 3 5 (0/1) temperature cycling (tc) (1) jedec jesd22 - a104d condition n, [ - 40c to +85c], soak mode 2 [5], 100 cycles 3 77 (0/1) board level tests test method/condition lot quantity sample / lot acc / reject criteria board mechanical shock jedec jesd22 - b104c, mil - std - 883h, method 2002.5, cond. e, 10000 gs , 0.2ms, + - x, y, z C 6 directions, 5 times/direction 1 5 (0/1) board temperature cycling (tc) (1) jedec jesd22 - a104d condition n, [ - 40c to +85c], soak mode 2 [5], 100 cycles 1 40 (0/1) (1) tests are preceded by msl3 preconditioning in accordance with jedec jesd22 - a113f
mpu - 3000/mpu - 3050 product specification do cument number: ps - mpu - 3000a - 00 revision: 2.9 release date: 11/14/2011 47 of 47 10 environmental compliance the mpu - 30x0 is rohs and green compliant. the mpu - 30x0 is in full environmental compliance as evidenced in report hs - mpu - 30x0a, materials declaration data sheet. environmental declaration disclaimer: invensense believes this environmental information to be correct but cannot guarantee accuracy or completeness. conformity documents for the above component constitutes are on file. invensense subcontracts manufacturing and the information containe d herein is based on data received from vendors and suppliers, which has not been validated by invensense. this information furnished by invensense is believed to be accurate and reliable. however, no responsibility is assumed by in vensense for its use, or for any infringements of patents or other rights of third parties that may result from its use. specificat ions are subject to change without notice. invensense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. invensense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. invensense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services det ailed therein. this includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. certain intellectual property owned by invensense and described in this document is patent protected. no license is granted by implication or otherwise under any patent or patent rights of invensense. this publication supersedes and replaces all inform ation previously supplied. trademarks that are registered trademarks are the propert y of their respective companies. invensense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass - destructive weapons or for any other weapons or life threatening applications, as well as in a ny other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. invensense ? , airsign ? , touchanywhere ? , and mo tioncommand ? , are registered trademarks of invensense, inc. , mpu ? , mpu - 30x0 ? , mpu - 3000 ? , mpu - 3050 ? , mpu - 6050?, imu - 3000?, motion processing unit ? , digital motion processor?, digital motion processing ? , dmp ? , motionapps?, motionprocessing?, motionprocessor ? , motionfusion? , instantgesture ? , ig ?, and blurfree? are trademarks of invensense, inc. ?20 1 1 invensense, inc. all rights reserved.

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